Solder Ball Test Method

Study of IMC vs Drop Test effect on Leadfree SAC and Polymer Solder Ball

Leaded solder ball was replaced by leadfree solder ball which is now widely used in semiconductor industries, due to the hazardous effects of lead to human’s health and toxicity for environment. Due to this, poor solder joint strength for Ball Grid Array (BGA) packages on leadfree devices is a reliability concern when subjected to reliability stress test. With a polymer core in the solder ball ...

Stereo Vision Based Automated Solder Ball Height Detection

Solder ball height inspection is essential to the detection of potential connectivity issues in semi-conductor units. Current ball height inspection tools such as laser profiling, fringe projection and confocal microscopy are expensive, require complicated setup and are slow, which makes them difficult to use in a real-time manufacturing setting. Therefore, a reliable, in-line ball height measu...

Nonlinear Analysis of Plastic Ball Grid Array Solder Joints

(2001) Nonlinear analysis of plastic ball grid array solder joints. Notice: Changes introduced as a result of publishing processes such as copy-editing and formatting may not be reflected in this document. For a definitive version of this work, please refer to the published source: ABSTRACT A nonlinear finite element analysis was carried out to investigate the viscoplastic deformation of solder...

Online test method of FPGA solder joint resistance with low power consumption

Interferometer Calibration using the Random Ball Test

Wenrui Cai, Dae Wook Kim, Ping Zhou, Robert E. Parks, James H. Burge College of Optical Science, University of Arizona, 1630 E. University Blvd., Tucson, AZ, USA 85721 [email protected] Abstract: Two different approaches (systematically and randomly rotating the CaliBall to calibrate a Fizeau interferometer transmission sphere) are demonstrated with similar calibration results. Thus, the ...